About DXP Copper (Phosphorus Copper)
DXP (phosphorus-doped) Copper contains 400–600ppm phosphorus, which suppresses anode passivation and controls dissolution in acid copper sulfate baths — the standard anode choice for bright acid copper plating and copper strike layers used as a nickel undercoat.
Also Known As
DHP Copper
Controlled Anode Dissolution
Phosphorus content prevents excessive anode passivation
Bright Deposit Support
Standard anode choice for bright acid copper plating
Nickel Undercoat Compatible
Suited to copper strike layers ahead of nickel plating
Industrial Applications of DXP Copper (Phosphorus Copper)
Packaging Details
- Packaging confirmed at order
- Bulk volumes for high-volume production
Storage & Handling
- Store in a dry, covered warehouse area
- Standard PPE recommended — gloves when handling
View Safety Data Sheet (SDS) →
Frequently Asked Questions
OF Copper Balls & Anodes
Oxygen-free copper balls and anodes (<5ppm O₂) for acid copper sulfate, pyrophosphate, and cyanide plating baths.
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Nickel Anode Plate
High-purity nickel anode plates for nickel electroplating baths — available in 1×1, 1×8, 1×12, 2×12, 4×12 and 4×24 sizes.
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Nickel Chips
Nickel chips (flat and plating rounds) for titanium basket anodes in nickel plating baths.
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